FORTH has developed inspection and wafer quality control systems based on non-linear (multiphoton) optical microscopy, for non-invasive, real-time feedback and thin-layer quality inspection. Non-linear microscopy could provide with sub-micrometer resolution, feedback in the process flow and in the in-line inspection of wafer defects. The technology provided by FORTH can have a strong impact in the optoelectronic industry while it can contribute to the optimized manufacturing efficiency by a high-end quality control monitoring in an ultra-fast, presice and non-destructive way.
Multiphoton microscopy station for thin-layer quality inspection system: A fs laser raster-scanning microscope using tight-focusing objective for providing a both lateral and vertical scanning volume for a fs-laser focus (@1.03 μm, 70 fs pulse widths and 76 MHz repetition rate) is developed by FORTH for the analysis of (optical) surfaces. The interaction of the laser pulse with the voxel of the volume is collected by an image system and processed towards a 3D volumetric image of the scanned volume.
Using FORTH’s microscope, imperfections are revealed below the surface of a cascade laser wafer (provided by ALPES). There, during the characterization of the semiconductor wafer usually classical microscopic imaging is applied, that only reveals defects on the surface of the wafer and the laser structures on it. But as the quantum cascade laser is a complex structure of many layers, where functional layers are also buried underneath the surface, the multiphoton microscopy provides the ability to also look for defects inside the material, improving quality control for the chips on the wafer level and allowing for an earlier decision about potentially failing chips.
Within the project, ALPES will provide several semiconductor wafer featuring laser chips for inspection using the new technology (multiphoton microscopy station for thin-layer quality inspection system). In particular, wafers from various stages of the fabrication processes will be provided followed the most critical and defect-prone steps such as the growth of the laser gain medium. The latest comprises a large number of ultra-thin layers grown in stack form that forms a series of quantum wells and barrier layers. In contrast to conventional laser diodes in the visible and near IR, QCLs comprise a significantly larger number of nano-layers, at the order of several tens of layers, rendering the strain-relief strategies that need to be applied very challenging. But better understanding the distribution of defect and the density of these defects, ALPES aims to:
INL is highly motivated to valorize the results of the project Intelligent Motion Control under Industry4.E (IMOCO4.E) that is funded under the Electronic Component Systems for European Leadership Joint Undertaking (ECSEL JU) Grant Agreement 101007311, with participants in Portugal receiving funds from the H2020 framework and the Portuguese Foundation for Science and Technology (FCT).
The overall aim of IMOCO4.E is to provide vertically distributed edge-to-cloud intelligence for machines, robots, and other human-in-the-loop cyber-physical systems having actively controlled moving elements. As detailed on the project website (www.imoco4e.eu), IMOCO4.E is developing several pilots and demonstrators, which will be used to show functionality of the IMOCO4.E platform on machinery developed by IMOCO4.E consortium and within existing industrial production lines, respectively. INL is developing a sensorized Near Field Communication (NFC) tag (a passive, self-powered wireless sensor) that can measure temperature while incorporated into injection-molded parts.
The overall requirements for small size and flexibility of the tag as well as for interfacing the miniature electrical components with a commercial NFC chip imposed multiple technical challenges for microfabrication and packaging of the electrical components that were custom designed and produced at INL. Specifically, the main challenges were (1) the design—the trade-off between miniaturization and performance and (2) microfabrication—the difficulty of patterning high-aspect-ratio features and vias on 10-25-µm-thick polymeric layers (photoresist and SU-8), as illustrated in the figure.
The fabricated NFC tags have been successfully tested in the laboratory in the context of the IMOCO4.E project. INL is now interested in exploring the pathways for valorization and exploitation of the technology, processes, and expertise resulting from this project in other NFC or alternative self-powered wireless sensing applications. Because the underlying technology comprises elements fabricated at microscale, showing it directly to potential partners is difficult. Accordingly, the activities proposed in the DemosAxia project will be critical for designing and producing effective demonstrators and promotional materials/activities for presenting this technology to potential partners, while pursuing valorization and exploitation opportunities, particularly at innovation events.